In this project, we are exploring classes of materials and assembly approaches that enable electronic devices with features - area coverage, mechanical properties, or geometrical forms - that would be impossible to achieve using traditional, wafer-based technologies. We pursue not only basic scientific studies in this area, but also engineering efforts to build functional systems that adopt bio-inspired designs or require integration with robotic systems, structural components and other non-planar, time-dynamic platforms. Examples of the former include electronic eyeball cameras that exploit curvilinear photodetector arrays for improved imaging characteristics. Examples of the latter include artificial tactile systems for robots and adaptive airframes in autonomous aerial vehicles.